PCB capabilities reviewed around your actual design.

Capabilities are reviewed against the actual fabrication data, material, copper weight, board thickness and special-process requirements of each project.

Capability	Project Support
PCB Types	Single-layer, multilayer, high-frequency and mixed-material PCB projects
Materials	FR-4, high-Tg FR-4, Rogers and PTFE material families
Board Thickness	Reviewed according to material system, stackup and mechanical requirements
Hole / Aspect Ratio	Reviewed according to finished thickness, material and drilling requirements
Trace / Space	Reviewed according to copper weight, layer structure and fabrication process
Copper Weight	Multiple copper-weight options available according to design requirements
Controlled Impedance	Supported on qualified designs with stackup and impedance requirements provided
Surface Finish	ENIG, HASL, Immersion Tin and Hard Gold options
Back Drilling	Available for qualified multilayer designs
Resin Plugging / VIPPO	Available for qualified via-in-pad and plugged-via designs
Gold Finger	Gold-finger, bevel and related edge-connector requirements supported
Special Mechanical Processing	Routing, controlled-depth and material-sensitive machining reviewed per drawing

Exact manufacturing limits and tolerances are confirmed after review of the Gerber, drawing, stackup and material requirements.

Engineering review

Send the fabrication data for a project-specific capability review.

For tighter geometries, special materials or advanced processes, our quotation review focuses on the actual stackup, copper weight, hole structure and finished-board requirements.

Send these details for a faster review

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Gerber / ODB++ and fabrication drawing

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Layer count, finished thickness and stackup

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Material type and copper weight

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Minimum hole, trace / space and key tolerances

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Impedance and surface-finish requirements

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Back drill, VIPPO, gold finger or other special notes